B11 · Semiconductor & Electronic Gas
Stainless Steel Plates for Semiconductor and Electronic Specialty Gases: 316L/304L Selection and 6 Part Lists
In our semiconductor and electronic specialty gases, we have organized six parts using stainless steel: commonly used 316L / 304L, with thickness ranging from 0.05–30 mm.
Six parts and material lists
| Part / Component | Recommended Grade | Specifications / Thickness | Surface | Main Failure Modes | Reference Standards |
|---|---|---|---|---|---|
| UHP Gas Transfer Pipelines | 316L VIM-VAR | 1/8″–2″ | Electropolished Ra≤0.4μm; Intergranular Corrosion Test | Particle Retention → Wafer Contamination; Cl⁻/F⁻ Specialty Gases Erosion; Weld Heat-Affected Zone (HAZ) Corrosion | SEMI F20 Grade 5；ASTM A269/A632；SEMI F19 |
| Specialty Gas Valve Bodies/Reducers/Diaphragm Valves | 316L VIM-VAR Forgings | DN1/4″–1″；Cv 0.05–1.30 | Electropolished Ra≤0.4μm | Valve Seat to Tube Wall Distance > 1D Forms Retention Dead Zones; Corrosive Specialty Gases Erosion | SEMI F20 4.6.2；ASTM A182 |
| Gas Filters/Fittings/Sleeves | 316L VIM-VAR | By Interface | Electropolished | Particle + Corrosion Product Blockage; Fitting Leaks | SEMI F20；ASTM A269 |
| CMP Slurry/Wet Chemicals Transfer Pipelines | 316L EP/PFA/PTFE Liners | 1/4″–2″ | Electropolished Ra≤0.4μm | Abrasive wear + strong acids/oxidants + particle buildup | SEMI F20；SEMI F57；ASTM A269 |
| Wafer washing tank/pads/nozzles | 316L/PFA/quartz/carbonized silicon | Tank 3-10mm | Polishing/deposition | HF/SC1/SC2 strong corrosion + particulate contamination | SEMI F20；ASTM A240 |
| Vacuum chamber/flanges/view window neck | 304L/316LVacuum grade | Body 6–30mm | 2B/Polished/Ironing | Low vent rate not met → Vacuum drops; Weld leaks | ASTM A240；SEMI F20；ISO 3669 |
Inside areStandard Configurations.Different parts in various media, temperatures, and welding methods may switch from 316L (6) to 304L (1) or 2205 —— Clarify usage conditions instead of specifying grades for easier quoting and material preparation.
Material Points
- The most common grade used in this industry is 316L (6), 304L (1) —— Numbers in parentheses indicate the number of parts involved, serving as a starting point for quotations and material procurement.
- Acidic media 316L is just the start, go higher with concentration and temperature for 904L / Duplex (2/6 hits).
- Thickness 0.5–30 mm: thin plates are mostly formed parts (consider bending rebound and deep drawing cracking), thick plates are mostly welded structures (consider heat input and sensitization).
Common Issues
Which stainless steel is used most for semiconductor and electronic specialty gases?
Out of the total 6 parts, 316L appears most frequently (6 hits) followed by 304L (1 hit). Specific to a part still depends on the medium and temperature, e.g., stainless countertops exposed to saltwater should switch from 304 to 316L.
What type of parts are prone to issues?
Based on failure descriptions, typical is "UHP gas conveying pipes": particulate buildup → wafer contamination; Cl⁻/F⁻ specialty corrosion; weld heat-affected zone (HAZ) corrosion. Recommended grade 316L VIM-VAR, size 1/8″–2″. For these conditions, it's recommended to specify medium concentration, temperature, and cleaning methods in the design phase.
What thickness should I select?
Thickness range in the list is 0.05–30 mm. For thin plates, consider bending and surface finish; for thick plates, welding and structural strength. Values may vary by manufacturer for the same location, review your drawing or operating conditions.
Related Materials and Adjacent Industries
Applications6